Top Page | English | 简体中文 | 繁體中文 | 한국어 | 日本語
Wednesday, 10 October 2018, 19:00 HKT/SGT

Source: Hua Hong Semiconductor
Hua Hong Semiconductor Second Generation 0.18um 5V/40V BCD Process Platform Successfully Mass Produced

HONG KONG, Oct 10, 2018 - (ACN Newswire) - Hua Hong Semiconductor Ltd (1347.HK), a global, leading specialty pure-play foundry, today announced that its second-generation 0.18um 5V/40V BCD process platform has successfully been mass produced. Featuring low on-resistance, a full high-voltage range and few photo etching layers, the platform is an ideal process choice for industrial control applications and DC-DC converters, among others.

This new platform has a 40V DMOS breakdown voltage of up to 52V, and on-resistance as low as 20 mOhm.mm2, reaching leading process levels of the node which can improve the drive capability of products, reduce the size of chips, expand the safe-operation-area (SOA) of high-voltage tubes and ensure the high reliability of products. The platform has a minimum of 18 mask layers, and offers a wide range of optional components including high-ohmic resistors, capacitors, Zener diodes, Schottky diodes, etc. This platform also offers access to an in-house designed standard cell library, SRAM compiler, IO and eFuse, providing a complete design solution for power management chips.

The Company has verified and moved into mass produced chip products in various fields including motor drive, fast charging, communication, security, DC-DC and LDO, in close cooperation with its many customers at home and abroad. With green technology, power management plays an important role. Hua Hong introduced a comprehensive power management (PMIC) BCD process solution and has a rich mass production experience at 0.5µm, 0.35µm and 0.18µm nodes. The Company will continue to leverage its expertise in BCD and eNVM processes, integrating the two to create high-end power management SOCs for intelligent power products.

"Hua Hong Semiconductor has always regarded the power management platform as a top priority of process R&D, and the mass production of the second-generation 0.18µm 5V/40V BCD process marks another improvement in our core competitiveness in the PMIC field," Dr. Kong Weiran, Executive Vice President of Hua Hong Semiconductor remarked. "Looking ahead, we will continue to develop more advanced intelligent power management platforms to provide customers with competitive advantages in differentiated technologies."

About Hua Hong Semiconductor
Hua Hong Semiconductor Limited (1347.HKG) is a global, leading pure-play foundry with specialty process platforms uniquely focused on eNVM, power discrete, analog & power management and logic & RF, and an outstanding quality control system that satisfies the strict requirements of automotive chip manufacturing. Hua Hong is part of the Huahong Group, a high-tech, globally oriented, highly competetive enterprise with innovative capabilities.

Hua Hong presently operates three 200mm wafer fabrication facilities within the Huahong Group (HH Fab1, HH Fab2 and HH Fab3) in Jinqiao and Zhangjiang, Shanghai, with a monthly 200mm-wafer capacity of over 170,000. A 300mm-wafer fabrication facility (HH Fab7) is being built in Wuxi's National High-Tech Industrial Development Zone. When completed, the Wuxi fab will increase to 40,000 the Company's monthly capacity of 300mm wafers. For more information, please visit

Oct 10, 2018 19:00 HKT/SGT
Topic: Press release summary
Sectors: Electronics
From the Asia Corporate News Network

Copyright © 2019 ACN Newswire. All rights reserved. A division of Asia Corporate News Network.

Hua Hong Semiconductor
June 14, 2018 09:36 HKT/SGT
The Analog IP Portfolio Enables Hua Hong Semiconductor to Focus on the Development of MCU Market
May 8, 2018 16:26 HKT/SGT
Hua Hong Semiconductor Redoubled Shipment of Financial IC Card Chips to Over 400 Million in 2017
Dec 27, 2017 17:17 HKT/SGT
Hua Hong Semiconductor's 90nm G2 eFlash Process Platform Successfully Achieved Mass Production
Dec 15, 2017 14:40 HKT/SGT
Hua Hong Semiconductor introduces 12-bit SAR ADC IP to enable Ultra-Low Power MCU Platforms
Nov 3, 2017 09:58 HKT/SGT
Hua Hong Semiconductor and SinoMCU Co-Released the First MCU Based on 95nm OTP Process Platform
Aug 30, 2017 12:31 HKT/SGT
Hua Hong Semiconductor to Make a Hit in the 8-bit MCU Market with Its 95nm eNVM Process Platform
Mar 30, 2017 13:05 HKT/SGT
Hua Hong Semiconductor Power Discrete Platform Crosses the 5-Million Wafer Shipment Mark
Feb 16, 2017 12:26 HKT/SGT
Hua Hong Semiconductor Doubles its Financial IC Card Chips Shipment in 2016
Jan 23, 2017 17:38 HKT/SGT
Hua Hong Semiconductor Achieves a Major Milestone in R&D of the Third-Generation Super Junction Technology
Oct 20, 2016 12:40 HKT/SGT
StarChip's Security IC Chip for Bank Card Based on HHGrace eNVM Process Acquires a CQM Certification from MasterCard
More news >>
 News Alerts
Copyright © 2019 ACN Newswire - Asia Corporate News Network
Home | About us | Services | Partners | Events | Login | Contact us | Privacy Policy | Terms of Use | RSS
US: +1 800 291 0906 | Beijing: +86 400 879 3881 | Hong Kong: +852 2217 2912 | Singapore: +65 6304 8926 | Tokyo: +81 3 6721 7212

Connect With us: