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Thursday, 27 June 2019, 12:15 HKT/SGT

Source: Hua Hong Semiconductor
Hua Hong Semiconductor 3rd-Generation 90nm eFlash Process Platform Achieves Mass Production

HONG KONG, June 27, 2019 - (ACN Newswire) - Hua Hong Semiconductor Ltd (HKG:1347), a global leading specialty pure-play foundry, announced that its 3rd-generation 90nm embedded flash (90nm eFlash) process platform has achieved mass production.

Hua Hong continues to improve competitiveness in the field of embedded Non-Volatile Memory (eNVM) technology. Through continuous innovation, the flash cell size of the 3rd-generation 90nm eFlash process platform is reduced by nearly 40% compared with 2nd-generation technology, hitting a record low in embedded flash technology among foundries worldwide of 90nm processing node.

Flash IP has a more obvious advantage in area, which further reduces the overall chip size, resulting in a greater number of dies on a single wafer. At the same time, the number of mask layers is further reduced, effectively shortening the manufacturing cycle., while a high level of reliability is maintained, reaching 100,000 write/erase cycles and data retention for 25 years.

Hua Hong Semiconductor has successfully launched three generations of eFlash process platforms at 90nm process node in recent years, striving to develop more cost-effective solutions while maintaining technical leadership. The stable mass production of the 3rd-generation eFlash platform provides continuous and stable support and solutions for smart cards and security chip products such as SIM cards, Ukey and traffic cards, as well as diversified products such as microcontrollers.

Dr. Kong Weiran, Executive Vice President of Hua Hong Semiconductor, said, "As a leader in eNVM technology, Hua Hong Semiconductor will continue to focus on the research and development of 200mm differentiation technology, aim for the market of high-density smart cards and high-end microcontrollers, provide significant optimization in terms of power consumption and chip size, and extend the existing technical advantage of 200mm to 300mm, to serve the domestic and overseas design houses better and satisfy the market needs."

About Hua Hong Semiconductor Limited
Hua Hong Semiconductor Limited (HKG:1347) is a global leading pure-play foundry with specialty process platforms uniquely focused on eNVM, power discrete, analog & power management and logic & RF. The Company's outstanding quality control system satisfies the strict requirements of automotive chip manufacturing. Hua Hong Semiconductor is part of the Huahong Group, which is an important member of China's 909 Project. With semiconductor manufacturing as its core business, the Huahong Group is a high-tech, globally oriented, highly competitive enterprise with innovative capabilities.

The Company presently operates three 200mm wafer fabrication facilities within the Huahong Group (HH Fab1, HH Fab2 and HH Fab3) in Jinqiao and Zhangjiang, Shanghai, with a total monthly 200mm-wafer capacity of 175,000 wafers. There is also a new 300mm-wafer fabrication facility (HH Fab7) being built in Wuxi's National High-Tech Industrial Development Zone. When completed, the Wuxi fab will increase the Company's monthly capacity by forty thousand 300mm wafers. For more information, please visit:

June 27, 2019 12:15 HKT/SGT
Topic: Press release summary
Sectors: Electronics, Daily Finance, Daily News
From the Asia Corporate News Network

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