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| Tuesday, November 5, 2013 |
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TDK Launches SHG4A Series of Serial ATA 3 Gbps Compliant Half Slim Type SSDs |
| TDK Corporation announced today the launch in November 2013 of the SHG4A series of half slim type solid state drive (SSD) modules for industrial applications. The new NAND flash memory modules support the serial ATA II standard and enable storage capacities of up to 128 GB also with SLC type NAND flash memory. more info >> |
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| Wednesday, October 23, 2013 |
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TDK Named as One of Thomson Reuters 'The World's Top 100 Most Innovative Organizations for 2013' |
| TDK Corporation announces that it has been selected as one of the 2013 Top 100 Global Innovators by Thomson Reuters (headquartered in New York with a Japan office in Minato-ku, Tokyo). more info >> |
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| Tuesday, May 7, 2013 |
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TDK Launches SDG4A Series of Solid State Drives With 3 Gbps Serial ATA Support |
| TDK Corporation announced today the launch in May 2013 of the SDG4A series of serial ATA II compatible industrial solid state drives (SSDs) in 2.5 inch form factor with a maximum capacity of 512 GByte. more info >> |
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| Monday, January 7, 2013 |
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TDK Launches New MLCC - Multilayer Ceramic Chip Capacitors - Website |
| TDK Corporation is pleased to announce the launch of its completely redesigned website for multilayer ceramic chip capacitors (MLCCs). The new site, which goes live on January 7, will welcome visitors with new features, search functions and tools at their disposal. more info >> |
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| Monday, July 23, 2012 |
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TDK Develops SD Card and MicroSD Card Series Optimised for Industrial Applications |
| Today TDK Corporation announced the development of a new series of SD/SDHC cards and microSD cards for industrial applications. more info >> |
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| Monday, July 9, 2012 |
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TDK Develops Ultra-Thin Receiving Coil Unit for Wireless Power Transfer |
| TDK Corporation is proud to announce the development of a TDK wireless power transfer coil unit designed for Smartphones and other mobile devices. The receiving coil designed for integration in Smartphones and similar represents an industry-leading achievement, featuring a thickness of a mere 0.57 mm. more info >> |
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| Tuesday, July 3, 2012 |
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TDK: New FOUP Load Port Models Launched |
| TDK Corporation developed two new FOUP* load port models (the TAS450 Type A2 and the TAS300 Type J1) for a semiconductor production equipment. Sales of both models will begin in July 2012. more info >> |
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| Wednesday, June 27, 2012 |
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Celebrating Independence Day by Lighting Up New York Times Square |
| The display will start running June 27 through July 8, 2012. This is the second collaboration with TDK and Toshiba since last Christmas. more info >> |
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| Wednesday, May 9, 2012 |
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TDK Launches Embedded mSATA Solid-State Drive with 3 Gbps Serial ATA Support Suitable for Industrial Applications |
| TDK Corporation has developed the mSATA type SSD (Solid-State Drive) SMG3B series with support for 3 Gbps serial ATA. The products will be available from July 2012. more info >> |
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| Wednesday, March 21, 2012 |
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TDK Launches eSSD Series |
| TDK Corporation has developed the eSSD series, a single chip 3Gbps SSD with serial ATA interface that uses multi-chip technology to integrate the TDK SSD controller GBDriver RS3 with NAND type flash memory in a single package. more info >> |
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