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  Press Releases
Thursday, September 26, 2013
Tanaka Precious Metals Establishes a Local Subsidiary in Singapore and Commences Operation on October 1
Thursday, August 29, 2013
Applications for the Subjects of the 2013 'Precious Metals Research Grants' Open on September 2
Monday, July 8, 2013
Electroplating Engineers of Japan (EEJA) has launched "POSFER-E series", which is compact, highly-functional and fully-automated electroplating semiconductor wafer equipment at a competitive price
Tuesday, July 2, 2013
Tanaka Kikinzoku International K.K. Certified as AEO Exporter
Thursday, May 9, 2013
Tanaka Precious Metals First to Obtain ISO/IEC17025 Accreditation for Silver Analysis Technology in Japan
Tuesday, April 16, 2013
Tanaka Precious Metals Records Highest Shipment Volume of Copper Bonding Wire in 2012 at Approximately Doubling the Previous Year's Volume
Thursday, March 28, 2013
Tanaka Precious Metals Announces Recipients of "Precious Metals Research Grants"
Thursday, March 21, 2013
Tanaka Precious Metals Commences Supply of Ultra-compact Crystal Oscillator Package Bonding Material Able to Halve Material Cost on March 22
Tuesday, February 26, 2013
Tanaka Precious Metals Constructs Dedicated Plant for the Development and Manufacture of Fuel Cell Catalysts
Thursday, January 10, 2013
Tanaka Precious Metals Commences Providing Samples of High-performance Copper Bonding Wire and Silver Bonding Wire Aimed at Mass Production This Spring

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