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SANTA CLARA, CA, Dec 2, 2013 - (ACN Newswire) - Manufacturing 3D NAND designs requires overcoming formidable technical challenges to create extremely complex high-aspect-ratio structures. The resulting reliability, density, performance, and power savings benefits will continue to drive this vertical NAND transition. On December 10, 2013, Applied Materials, Inc. will host an important forum in Washington D.C. for a thought-provoking examination of the growing momentum in 3D NAND from device, system, and user perspectives.
3D NAND is clearly here to stay with leading-edge memory chipmakers focusing significant resources on this segment. But while 3D NAND promises substantial benefits in easing key planar scaling limitations, several questions remain regarding the future of this technology. How far can it be scaled? What issues will affect its scaling? Which applications will use it first? Will 3D NAND continue lowering the cost per bit? What technologies will follow?
Applied Materials and guest panelists from several industry leaders will provide insight on these critical issues in a panel titled "3D NAND Is a Reality - What's Next?" To register for this event, please visit http://www.appliedmaterials.com/NAND-panel.
Moderator: Gill Lee, senior director, principal member of technical staff, Silicon Systems Group, Applied Materials
Panel:
-- Ritu Shrivastava, Ph.D. - vice president, technology development, SanDisk Corporation
-- Chuck Dennison - senior director, process integration, Micron Technology, Inc.
-- Seok-Kiu Lee - vice president, head of flash device technology group, R&D division, SK hynix Inc.
-- Hang-Ting Lue, Ph.D. - deputy director, Nanotechnology R&D division, Macronix International Co., Ltd.
-- Bradley Howard, Ph.D. - vice president, advanced technology group, Etch, Applied Materials, Inc.
Where: Omni Shoreham Hotel, 2500 Calvert Street NW, Washington, D.C.
When: Tuesday, December 10, 2013
Schedule:
-- 5:00 - 6:00pm Shuttle from Hilton Washington Hotel
-- 5:00 - 6:15pm Registration and Reception
-- 6:15 - 7:30pm Panel Discussion
-- 7:30pm Return shuttle to Hilton Washington Hotel
Applied Materials, Inc. (Nasdaq:AMAT) is the global leader in providing innovative equipment, services and software to enable the manufacture of advanced semiconductor, flat panel display and solar photovoltaic products. Our technologies help make innovations like smartphones, flat screen TVs and solar panels more affordable and accessible to consumers and businesses around the world. Learn more at www.appliedmaterials.com.
Contact:
Connie Duncan (editorial/media) +1-408-332-0541
Michael Sullivan (financial community) +1-408-986-7977
This announcement is distributed by NASDAQ OMX Corporate Solutions on behalf of NASDAQ OMX Corporate Solutions clients.
The issuer of this announcement warrants that they are solely responsible for the content, accuracy and originality of the information contained therein.
Source: Applied Materials via Globenewswire
Topic: General Announcement
Source: Applied Materials, Inc.
http://www.acnnewswire.com
From the Asia Corporate News Network
Copyright © 2025 ACN Newswire. All rights reserved. A division of Asia Corporate News Network.
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