Top Page | English | 简体中文 | 繁體中文 | 한국어 | 日本語
Monday, 1 February 2016, 15:20 HKT/SGT
Share:
    

Source: Fujitsu Ltd
Tokyo Institute of Technology and Fujitsu Achieve Wireless Transmission Speeds of 56 Gbps, World's Fastest
Millimeter-waveband wireless device implemented in CMOS integrated circuit

TOKYO, Feb 1, 2016 - (JCN Newswire) - Tokyo Institute of Technology and Fujitsu Laboratories Ltd. today announced that, in an effort to further enlarge the capacity of wireless equipment, they have developed a CMOS wireless transceiver chip that can process signals at high speeds with little loss across a broad range of frequencies, from 72 to 100 gigahertz (GHz). They also developed technology to modularize it. With these developments, they succeeded in achieving wireless transmission speeds of 56 Gigabits per second (Gbps), the world's fastest.

In recent years, to cope with the large increase in data traffic resulting from the widespread use of smartphones and other devices, networks that link base stations use optical fiber. One issue with this approach, however, is that it is difficult to expand service in areas where it is difficult to install a network of optical fiber cables, such as in urban areas or areas surrounded by rivers or mountains. To deal with this issue, Tokyo Institute of Technology and Fujitsu Laboratories have now developed high-speed wireless transceiver technologies that use the millimeter-waveband (30-300 GHz), where there are few competing wireless applications, and which are capable of large-capacity communications.

This technology makes it possible to have high-capacity wireless communications equipment that can be installed outdoors in applications where fiber-optic networks would be difficult to lay.

The details of this technology will be announced at the IEEE International Solid-State Circuits Conference 2016 (ISSCC 2016), the largest conference related to semiconductor technology, opening in San Francisco on January 31 (ISSCC Presentation Number 13.3).

Background

With sharp increases in data communications traffic resulting from the proliferation of smartphones, the expansion in the capacity of backbone networks - which connect wireless base stations to core networks, and base stations to each other - is accelerating. In the past, macro-cell base stations were mainly used, each of which can cover an area with several kilometers of range, but in recent years these have been supplemented with large quantities of small-cell base stations, each of which has a range of only a few hundred meters, to accommodate the increase in communications traffic.

Also, fiber-optic lines, which can transmit large volumes of data, are currently the most common way to handle communications between base stations. But laying new fiber-optic cables can be difficult in tightly packed urban areas, or in places hemmed in by mountains or rivers, so it has been hoped that high-capacity wireless equipment could be created that can easily be installed outdoors.
Issues

High-capacity wireless transmissions need to use broad frequency ranges. This makes the use of the millimeter-waveband a suitable option, as few competing wireless applications use it. But because the millimeter-waveband uses such high frequencies, designing CMOS integrated circuits for that purpose has been a challenge, as the circuits need to be designed to operate near their limits. It has also been difficult to develop low-loss transceiver circuits that modulate and demodulate broadband signals into and out of the millimeter-waveband with high quality, and low-loss interface circuits, which connect the circuit board to the antenna.

About the Technology

The newly developed CMOS wireless transceiver chip and the wireless module that includes it (Figure 1*) are comprised of two key technologies.

1. Low-loss, high-bandwidth transceiver circuit

Tokyo Institute of Technology developed a technology for broadband, low-loss transceiver circuits in which data signals are split in two, with each converted to different frequency ranges, and then recombined (Figure 2*). Each signal is modulated into a band 10-GHz wide, with the low-band occupying the 72-82 GHz range, and the high-band occupying the 89-99 GHz range. This technology enables modulation on an ultra-wideband signal of 20 GHz, with low noise and a similar range in the ratio between input and output power as existing 10 GHz band methods, which results in high-quality signal transmissions.

Tokyo Institute of Technology also developed an amplifier to send and receive as radio waves signals converted to the millimeter-waveband. The ultra-wideband amplifier for 72 to 100 GHz was designed with circuit technologies that stabilize the amplification ratio by feeding the amplitude of the output signal back to the input side for signal components whose amplification ratio decreases based on frequency.

2. Modularization technology

The signal converted to the millimeter-waveband by the semiconductor chip is transported over the circuit board's signal path and supplied to the antenna. Because the antenna is made out of a waveguide (a metallic cylinder), there needs to be an ultra-wideband, low-loss connection between the printed circuit board and the waveguide. Fujitsu Laboratories and Tokyo Institute of Technology developed an interface between the circuit board and waveguide that uses a specially designed pattern of interconnects on the printed circuit board to adjust the impedance for the ultra-wideband range, enabling loss in the desired frequency range to be greatly reduced.

In this development project, Tokyo Institute of Technology was primarily responsible for reducing transceiver-circuit losses and developing broadband technologies, while Fujitsu Laboratories mainly handled modularization technologies.

Results

Indoor data-transfer tests were conducted, with two modules facing each other separated by a distance of 10 cm. These tests achieved data-transfer rates of 56 Gbps, the fastest wireless transmission speeds in the world, with loss of maximum 10% between the waveguide and circuit board.

By combining the technologies developed in this project with high-output amplifier technology, used to amplify the signal and increase the transport range, and baseband-circuit technology, used to process ultra-wideband signals, it is possible to increase the capacity of wireless equipment that can be installed outdoors.

By doing so, even in places where new fiber-optic lines are difficult to install, such as urban areas and places surrounded by mountains or rivers, a high-capacity wireless base station network can be deployed, thereby contributing to the provision of a comfortable communications environment in those places.

Future Plans

Fujitsu Laboratories aims to have a commercial implementation of wireless trunk lines for cellular base stations around 2020.

Read the full release with the figures(*) at www.fujitsu.com/global/about/resources/news/press-releases/2016/0201-02.html.

About Tokyo Institute of Technology

Tokyo Institute of Technology stands at the forefront of research and higher education as the leading university for science and technology in Japan. Tokyo Tech researchers excel in a variety of fields, such as material science, biology, computer science and physics. Founded in 1881, Tokyo Tech has grown to host 10,000 undergraduate and graduate students who become principled leaders of their fields and some of the most sought-after scientists and engineers at top companies. Embodying the Japanese philosophy of monotsukuri, meaning technical ingenuity and innovation, the Tokyo Tech community strives to make significant contributions to society through high-impact research. Please see http://www.titech.ac.jp/english

About Fujitsu Laboratories

Founded in 1968 as a wholly owned subsidiary of Fujitsu Limited, Fujitsu Laboratories Ltd. is one of the premier research centers in the world. With a global network of laboratories in Japan, China, the United States and Europe, the organization conducts a wide range of basic and applied research in the areas of Next-generation Services, Computer Servers, Networks, Electronic Devices and Advanced Materials. For more information, please see: http://jp.fujitsu.com/labs/en.


Contact:
Tokyo Institute of Technology
Center for Public Affairs and Communications
E-mail: media@jim.titech.ac.jp

Fujitsu Limited
Public and Investor Relations
Tel: +81-3-3215-5259
URL: www.fujitsu.com/global/news/contacts/

Fujitsu Laboratories Ltd.
Devices & Materials Laboratory
E-mail: fbh@ml.labs.fujitsu.com



Topic: Press release summary
Source: Fujitsu Ltd

Sectors: Electronics
http://www.acnnewswire.com
From the Asia Corporate News Network


Copyright © 2023 ACN Newswire. All rights reserved. A division of Asia Corporate News Network.


Fujitsu Ltd Links

http://www.fujitsu.com

https://plus.google.com/+Fujitsu

https://www.facebook.com/FujitsuJapan

https://twitter.com/Fujitsu_Global

https://www.youtube.com/user/FujitsuOfficial

https://www.linkedin.com/company/fujitsu/

Fujitsu Ltd
Sept 22, 2023 15:20 HKT/SGT
Fujitsu marks next stage of "Work Life Shift" with new corporate hubs in Tokyo area to boost productivity, data-driven management
Sept 22, 2023 11:32 HKT/SGT
Fujitsu and Hokuhoku Financial Group launch trials for generative AI to streamline operations for Hokuriku Bank and Hokkaido Bank
Sept 19, 2023 09:34 HKT/SGT
Fujitsu launches new offering to support sustainable enterprise transformation as Japan's first premium supplier for RISE with SAP
Sept 19, 2023 09:05 HKT/SGT
Fujitsu strengthens DX consulting capabilities with plans to acquire Australian consultancy MF & Associates - investing for government and healthcare customer success
Sept 15, 2023 09:23 HKT/SGT
Fujitsu and the Linux Foundation launch Fujitsu's automated machine learning and AI fairness technologies as Linux Foundation hosted open source projects
Sept 14, 2023 09:33 HKT/SGT
Fujitsu and Baptist Health South Florida transform operating room scheduling with newly launched solution to boost utilization rates and the financial health of the surgical discipline
Sept 13, 2023 09:19 HKT/SGT
Fujitsu pioneering supply chain CO2 visualization with successful participation in WBCSD PACT Implementation program
Sept 4, 2023 11:35 HKT/SGT
Fujitsu acquires Thailand-based SAP consultancy Innovation Consulting Services, underpinning M&A growth strategy and accelerating SAP capabilities in Asia Pacific
Aug 28, 2023 10:16 HKT/SGT
Fujitsu develops pioneering millimeter-wave chip technology for 5G radio units
Aug 28, 2023 09:23 HKT/SGT
Fujitsu accelerates plans to achieve net zero greenhouse gas emissions across its supply chain, setting fiscal 2040 as new target
More news >>
 News Alerts
Copyright © 2023 ACN Newswire - Asia Corporate News Network
Home | About us | Services | Partners | Events | Login | Contact us | Privacy Policy | Terms of Use | RSS
US: +1 214 890 4418 | Beijing: +86 400 879 3881 | Hong Kong: +852 8192 4922 | Singapore: +65 6549 7068 | Tokyo: +81 3 6859 8575

Connect With us: