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Easy-to-process Al plate with high strength suitable for mobile device enclosure |
TOKYO, Apr 25, 2016 - (JCN Newswire) - Showa Denko ("SDK"; TSE:4004) has developed "ST60-HSM"* aluminum plate, a new grade product of ST60-series aluminum plates which boast high thermal conductivity and high strength. ST60-HSM has attained high strength equivalent to A6061** aluminum alloy, while maintaining the same bendability and thermal conductivity as existing grades of ST60 series have. SDK started to manufacture samples of ST60-HSM under potential customers' specifications this April, aiming to go into quantity production as early as possible.
| Showa Denko Develops High-Strength Version of ST60 Aluminum Plate |
SDK developed the first product of ST60-series aluminum plates in 2001. ST60 series is equal to pure aluminum in thermal conductivity and heat radiation capacity, and A5052*** aluminum alloy, which is widely used as material for frames, in strength. Since their launches, ST60-T3, that features high-bendability, has been used as heat sink, and ST60-T8, that features high-strength, has been used mainly as metallic base panels and parts for smartphones.
In recent years, manufacturers of mobile devices including smartphones and tablets tend to apply metal enclosures to high-end and middle-range products in order to give them enhanced rigidity and better designs. Moreover, these manufacturers expressly prefer to apply aluminum enclosures in order to take advantage of attractiveness of anodized surfaces. Though previously launched grades of ST60 series have already been applied to enclosures for mobile devices, SDK developed ST60-HSM this time in order to meet increasing need for stronger aluminum enclosures. ST60-HSM, samples of which we started to manufacture, is as processable as ST60-T3, while having more strength than ST60-T8. ST60-HSM's tensile strength is equivalent to that of A6061, which has higher tensile strength than A5052 aluminum alloy. By putting ST60-HSM on the market, SDK aims to expand adoption of ST60 series as enclosures for mobile devices.
In the field of materials for electronic devices, end-product manufacturers desire casing components with light weight, high strength and efficient heat radiation in order to enclose downsized and more integrated parts and instruments. SDK will continue meeting customers' expectations with its alloy designing and aluminum processing technologies cultivated over many years.
Press release (PDF): http://www.sdk.co.jp/english/news/15030/12589.html
Notes: * HSM is an abbreviation of High Strength Metal. ** A6061: A6000-series aluminum alloys contain magnesium and silicone as additives. They have high strength, excellent anticorrosiveness and machinability to be used as frames. A6061 aluminum alloy contains copper and other metals as additives to enhance strength, and shows further strength after solution, hardening and aging treatments. ***A5052: A5000-series aluminum alloys contain magnesium as an additive. A5052 aluminum alloy has medium strength among aluminum alloys, and known as standard material. A5052 has excellent anticorrosiveness, seawater resistance, and weldability, and is used as material for ships, automobile parts, interior and exterior finishing materials.
Contact:
Showa Denko
Public Relations Office
Phone: 81-3-5470-3235
Topic: New Product
Source: Showa Denko K.K.
Sectors: Chemicals, Spec.Chem
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From the Asia Corporate News Network
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