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  Press Releases
Thursday, June 3, 2021
Hua Hong Semiconductor Achieved Mass Production of 12'' 90nm BCD
Thursday, August 27, 2020
Hua Hong Semiconductor Launches 90nm Ultra-Low-Leakage Embedded Flash Process Platform to Power High-Capacity MCU Solutions
Friday, July 31, 2020
Hua Hong Semiconductor Relies on '8-inch + 12-inch' Strategy to Accelerate Development in IGBT Market
Monday, July 20, 2020
Hua Hong Semiconductor Continues to Build a Superior eNVM Process Platform
Thursday, June 27, 2019
Hua Hong Semiconductor 3rd-Generation 90nm eFlash Process Platform Achieves Mass Production
Wednesday, October 10, 2018
Hua Hong Semiconductor Second Generation 0.18um 5V/40V BCD Process Platform Successfully Mass Produced
Thursday, June 14, 2018
The Analog IP Portfolio Enables Hua Hong Semiconductor to Focus on the Development of MCU Market
Tuesday, May 8, 2018
Hua Hong Semiconductor Redoubled Shipment of Financial IC Card Chips to Over 400 Million in 2017
Wednesday, December 27, 2017
Hua Hong Semiconductor's 90nm G2 eFlash Process Platform Successfully Achieved Mass Production
Friday, December 15, 2017
Hua Hong Semiconductor introduces 12-bit SAR ADC IP to enable Ultra-Low Power MCU Platforms

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