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  Press Releases
Friday, November 3, 2017
Hua Hong Semiconductor and SinoMCU Co-Released the First MCU Based on 95nm OTP Process Platform
Wednesday, August 30, 2017
Hua Hong Semiconductor to Make a Hit in the 8-bit MCU Market with Its 95nm eNVM Process Platform
Thursday, March 30, 2017
Hua Hong Semiconductor Power Discrete Platform Crosses the 5-Million Wafer Shipment Mark
Thursday, February 16, 2017
Hua Hong Semiconductor Doubles its Financial IC Card Chips Shipment in 2016
Monday, January 23, 2017
Hua Hong Semiconductor Achieves a Major Milestone in R&D of the Third-Generation Super Junction Technology
Thursday, October 20, 2016
StarChip's Security IC Chip for Bank Card Based on HHGrace eNVM Process Acquires a CQM Certification from MasterCard
Monday, August 22, 2016
Hua Hong Semiconductor Taps Potential of International MCU Markets
Wednesday, July 20, 2016
Hua Hong Semiconductor Taps New Energy Vehicle Market with FS IGBT Expertise
Thursday, June 2, 2016
Hua Hong Semiconductor Celebrates the 100,000th Wafers Shipment Milestone of Its Super Junction Process Platform
Tuesday, May 3, 2016
Hua Hong Semiconductor Gains Leadership in the LED Lighting Market with an Aggregate Shipment of 600 Million Chips Based on 700V BCD Platform

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