Top Page | English | 简体中文 | 繁體中文 | 한국어 | 日本語
Thursday, 16 February 2017, 12:26 HKT/SGT
Share:
    

Source: Hua Hong Semiconductor
Hua Hong Semiconductor Doubles its Financial IC Card Chips Shipment in 2016

HONG KONG, Feb 16, 2017 - (ACN Newswire) - Hua Hong Semiconductor Limited ("Hua Hong Semiconductor" or the "Company", together with its subsidiaries, the "Group"; stock code: 1347.HK), a global leading pure-play 200mm foundry, today announced that its financial IC card chips shipment has more than doubled in 2016, up to about 200 million, including chips for bank IC cards, as well as social security and health cards with financial payment function.

Compared with traditional magnetic cards, financial IC cards featuring an embedded chip for data storage deliver such features as high security, large memory and versatility, which will gradually replace traditional magnetic cards. Now, the People's Bank of China is vigorously promoting the EMV (Europay, MasterCard and Visa) migration. In 2015, total shipment of locally fabricated bank IC cards was about 6 million, less than 1% of the market capacity. As the local chip makers improved their technologies and acquired regulatory approval for their products, localization of bank IC cards had gained the initial momentum in 2016. As anticipated, locally produced chips will make bigger contribution to China's financial IC card segment in 2017.

A celebrated Chinese IC manufacturer with a proven track record of 20 years, Hua Hong Semiconductor possesses proven 0.13/0.11um Embedded Non-Volatile Memory (eNVM) process technologies that feature outstanding stability, reliability and radiation resistance, as well as low power. Building upon its process expertise, the Company stays on course of technical upgrade and innovation, introducing the more advanced 90nm eNVM process for reduced die size to deliver more leading and competitive solutions to customers. In 2016, the financial IC cards produced on Hua Hong Semiconductor's eNVM process platform acquired the prestigious CC EAL5+ and EMVCo security certificates as well as MasterCard CQM certification, proving that the Company's process for financial IC card chip and security management system have reached the internationally advanced level and gained worldwide recognition, laying a solid foundation for the Company to tap potentials in the local and international financial market.

"Remaining focused on financial IC cards for years, Hua Hong Semiconductor has shaped a 'Made in China' brand that delivers the unique benefits of technology plus quality service." Said Mr. Fan Heng, Executive Vice President of Hua Hong Semiconductor, "Building upon our advanced specialty eNVM process technology and constant pursuit of highest-quality chips for financial IC cards, we will embrace the market opportunities to deliver excellent and secure services to our partners in the local and international financial sector with robust and quality chips, and bring the 'Made in China' financial IC card chips to worldwide."



Topic: Press release summary
Source: Hua Hong Semiconductor

Sectors: Electronics, Daily Finance, Daily News
http://www.acnnewswire.com
From the Asia Corporate News Network


Copyright © 2024 ACN Newswire. All rights reserved. A division of Asia Corporate News Network.



Hua Hong Semiconductor
June 3, 2021 12:30 HKT/SGT
Hua Hong Semiconductor Achieved Mass Production of 12'' 90nm BCD
Aug 27, 2020 13:00 HKT/SGT
Hua Hong Semiconductor Launches 90nm Ultra-Low-Leakage Embedded Flash Process Platform to Power High-Capacity MCU Solutions
July 31, 2020 12:28 HKT/SGT
Hua Hong Semiconductor Relies on '8-inch + 12-inch' Strategy to Accelerate Development in IGBT Market
July 20, 2020 12:50 HKT/SGT
Hua Hong Semiconductor Continues to Build a Superior eNVM Process Platform
June 27, 2019 12:15 HKT/SGT
Hua Hong Semiconductor 3rd-Generation 90nm eFlash Process Platform Achieves Mass Production
Oct 10, 2018 19:00 HKT/SGT
Hua Hong Semiconductor Second Generation 0.18um 5V/40V BCD Process Platform Successfully Mass Produced
June 14, 2018 09:36 HKT/SGT
The Analog IP Portfolio Enables Hua Hong Semiconductor to Focus on the Development of MCU Market
May 8, 2018 16:26 HKT/SGT
Hua Hong Semiconductor Redoubled Shipment of Financial IC Card Chips to Over 400 Million in 2017
Dec 27, 2017 17:17 HKT/SGT
Hua Hong Semiconductor's 90nm G2 eFlash Process Platform Successfully Achieved Mass Production
Dec 15, 2017 14:40 HKT/SGT
Hua Hong Semiconductor introduces 12-bit SAR ADC IP to enable Ultra-Low Power MCU Platforms
More news >>
 News Alerts
Copyright © 2024 ACN Newswire - Asia Corporate News Network
Home | About us | Services | Partners | Events | Login | Contact us | Privacy Policy | Terms of Use | RSS
US: +1 214 890 4418 | Beijing: +86 400 879 3881 | Hong Kong: +852 8192 4922 | Singapore: +65 6549 7068 | Tokyo: +81 3 6859 8575

Connect With us: