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| Tuesday, April 12, 2016 |
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TANAKA and S.E.I. Develop High-Power LED Modules Using AuRoFUSE(TM) Low-Temperature Bonding Material |
| Tanaka Kikinzoku Kogyo K.K. and S.E.I. Co., Ltd. announced that they have developed LED (light-emitting diode) modules with higher power than existing products by using AuRoFUSE(TM) with sub-micron size (one-ten thousandth of a millimeter) gold particles as a low-temperature bonding material. more info >> |
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| Monday, February 29, 2016 |
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TANAKA to Exhibit at FC EXPO 2016 |
| Tanaka Holdings Co., Ltd. today announced that Tanaka Precious Metals, Tanaka Kikinzoku Kogyo K.K. will exhibit at "FC EXPO 2016 - 12th International Hydrogen and Fuel Cell Expo," one of the world's largest fuel cell exhibitions, which will be held at Tokyo Big Sight from Wednesday, March 2 until Friday, March 4, 2016. more info >> |
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| Thursday, February 4, 2016 |
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TANAKA to Exhibit at MD&M West 2016 |
Tanaka Holdings Co., Ltd. announced today that the manufacturing business of Tanaka Precious Metals, Tanaka Kikinzoku Kogyo K.K., will exhibit at Medical Design & Manufacturing West (MD&M West) 2016, one of the world's largest medical equipment manufacturing exhibitions, which will be held in Anaheim, USA, from February 9 to 11, 2016.
more info >> |
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| Saturday, November 28, 2015 |
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Tanaka Precious Metals to Mass-produce Cadmium-free Electrical Contact Material |
| Tanaka Holdings Co., Ltd. announced today that the manufacturing business of the Tanaka Precious Metals, Tanaka Kikinzoku Kogyo K.K. has successfully developed CDF-10, a cadmium-free electrical contact material used primarily in vehicles and smartphones with improved sliding wear resistance compared to existing products. more info >> |
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| Thursday, November 26, 2015 |
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Tanaka Precious Metals to Start Full-scale Mass Production of CDF-10 on December 1: Long-life, Inexpensive Cadmium-free Electrical Contact Material for Vehicles, Smartphones and Consumer Electronics |
| Tanaka Holdings Co., Ltd. announced today that the manufacturing business of the Tanaka Precious Metals, Tanaka Kikinzoku Kogyo K.K. has successfully developed CDF-10, a cadmium-free electrical contact material used primarily in vehicles and smartphones with improved sliding wear resistance*1 compared to existing products. more info >> |
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| Thursday, October 1, 2015 |
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Tanaka Precious Metals Establishes TANAKA America in Silicon Valley as Base for Global Strategy |
| TANAKA HOLDINGS Co., Ltd. announced today that the manufacturing business of Tanaka Precious Metals, Tanaka Kikinzoku Kogyo K.K. will be establishing TANAKA America Inc. on Thursday, October 1, 2015 in San Jose, California. more info >> |
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| Thursday, September 17, 2015 |
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Precious Metals Research Grants of Up to 5 Million Yen Offered by the Tanaka Memorial Foundation; Applications for Research Projects Open on October 1 |
| Tanaka Holdings Co., Ltd. announced today that by the Tanaka Memorial Foundation will accept applications for the 2015 Precious Metals Research Grants from October 1 through November 30, 2015. more info >> |
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| Thursday, September 10, 2015 |
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Electroplating Engineers of Japan Establishes Local Subsidiary in Shanghai |
| Tanaka Holdings Co., Ltd. today announced that Electroplating Engineers of Japan, Limited, which operates the Tanaka Precious Metals' plating business will establish EEJA Shanghai as a local subsidiary in Shanghai in order to expand and enhance the plating business in China, with operations set to start on September 10. more info >> |
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| Thursday, July 16, 2015 |
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Correction: Electroplating Engineers of Japan Launches Semiconductor Wafer Cup-type Ultra-compact Plating Laboratory Equipment on July 15, Enabling Plating Equivalent to Mass Production Machines |
| Tanaka Holdings Co., Ltd. today announced that Electroplating Engineers of Japan, Limited has developed, and launched from July 15, the RAD-Plater cup-type ultra-compact plating laboratory equipment for semiconductor wafers, which achieves equivalent films to mass-production machines. more info >> |
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| Wednesday, July 15, 2015 |
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Electroplating Engineers of Japan Launches Semiconductor Wafer Cup-type Ultra-compact Plating Laboratory Equipment on July 15, Enabling Plating Equivalent to Mass Production Machines |
Tanaka Holdings Co., Ltd. today announced that Electroplating Engineers of Japan, Limited has developed, and launched from July 15, the RAD-Plater cup-type ultra-compact plating laboratory equipment for semiconductor wafers, which achieves equivalent films to mass-production machines.
more info >> |
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