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  Press Releases
Wednesday, January 8, 2014
Tanaka Precious Metals Commences Sales of High Heat-resistant Aluminum Alloy Bonding Wire on January 9
Tuesday, December 10, 2013
Tanaka Precious Metals, Newlong Seimitsu Kogyo and Taiyo Chemical Industry Commence to Provide Submicron Gold Particle Micro-composite Pattern Printing Technology on December 4
Tuesday, November 26, 2013
Tanaka Precious Metals Succeeds in Recovery of Trace Amounts of Precious Metals by Detoxifying Cyanogen Plating Waste Liquid
Thursday, September 26, 2013
Tanaka Precious Metals Establishes a Local Subsidiary in Singapore and Commences Operation on October 1
Thursday, August 29, 2013
Applications for the Subjects of the 2013 'Precious Metals Research Grants' Open on September 2
Monday, July 8, 2013
Electroplating Engineers of Japan (EEJA) has launched "POSFER-E series", which is compact, highly-functional and fully-automated electroplating semiconductor wafer equipment at a competitive price
Tuesday, July 2, 2013
Tanaka Kikinzoku International K.K. Certified as AEO Exporter
Thursday, May 9, 2013
Tanaka Precious Metals First to Obtain ISO/IEC17025 Accreditation for Silver Analysis Technology in Japan
Tuesday, April 16, 2013
Tanaka Precious Metals Records Highest Shipment Volume of Copper Bonding Wire in 2012 at Approximately Doubling the Previous Year's Volume
Thursday, March 28, 2013
Tanaka Precious Metals Announces Recipients of "Precious Metals Research Grants"

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