Top Page | English | 简体中文 | 繁體中文 | 한국어 | 日本語
Friday, 27 February 2015, 12:00 HKT/SGT
Share:
    

Source: Hua Hong Semiconductor
Hua Hong Semiconductor Launches 0.2um RF SOI Process Design Kit

HONG KONG, Feb 27, 2015 - (ACN Newswire) - Hua Hong Semiconductor Limited ("Hua Hong Semiconductor" or the "Company", together with its subsidiaries, the "Group", stock code: 1347), a leading pure-play 200mm foundry in the world, announced today that the launch of its 0.2um Radio Frequency ("RF") Silicon On Insulator ("SOI") process design kit ("PDK").The announcement indicated the new 0.2um SOI RF technology platform has been successfully validated and is ready for customers' product design and development. The launch of the new PDK aims to support customers efficiently, in terms of design and tape-out of high-quality RF components.

The Company's 0.2um RF SOI technology platform is tailored and optimized for wireless RF front-end switch application. Compared with gallium arsenide ("GaAs") and silicon-on-sapphire ("SOS") alternatives, SOI provides excellent performance and scalability through a cost-effective process to quickly achieve the design targets and enhance the product competitiveness. The SOI technology platform provides a 2.5V device with lower switch insertion loss, higher isolation and better linearity.

The Company's new PDK solution is developed from Cadence's IC5141 EDA software, and integrates RF modeling and simulation platform such as PSP SOI and BSIM SOI. This 0.2um RF SOI PDK offering provides convenience to designers who focus on optimizing both the RF performance and die size. They could design and create high performance and low power wireless RF front-end switch, thereby minimizing the revision of designs and greatly shortening the time for customers to launch their products in the market.

Dr. Weiran Kong, Executive Vice President of Hua Hong Semiconductor said, "With the booming of mobile internet and intelligent terminal in recent years, there are more and more applications of consumer electronics with the use of RF SOI design. 0.2um RF SOI technology is one of our focuses. With this new offering, we will actively help our customers to capture market opportunities. The technology is ideal for RF switch designs such as smartphones and connected devices of Internet of Things. Through adding 0.2um RF SOI technology solution into our RF portfolio, we are able to provide customers with comprehensive, cost effective and high performance RF solutions, which also include RF CMOS, SiGe BiCMOS and embedded Flash technology with RF PDK."


Topic: Press release summary
Source: Hua Hong Semiconductor

Sectors: Electronics, Daily Finance, Daily News
http://www.acnnewswire.com
From the Asia Corporate News Network


Copyright © 2024 ACN Newswire. All rights reserved. A division of Asia Corporate News Network.



Hua Hong Semiconductor
June 3, 2021 12:30 HKT/SGT
Hua Hong Semiconductor Achieved Mass Production of 12'' 90nm BCD
Aug 27, 2020 13:00 HKT/SGT
Hua Hong Semiconductor Launches 90nm Ultra-Low-Leakage Embedded Flash Process Platform to Power High-Capacity MCU Solutions
July 31, 2020 12:28 HKT/SGT
Hua Hong Semiconductor Relies on '8-inch + 12-inch' Strategy to Accelerate Development in IGBT Market
July 20, 2020 12:50 HKT/SGT
Hua Hong Semiconductor Continues to Build a Superior eNVM Process Platform
June 27, 2019 12:15 HKT/SGT
Hua Hong Semiconductor 3rd-Generation 90nm eFlash Process Platform Achieves Mass Production
Oct 10, 2018 19:00 HKT/SGT
Hua Hong Semiconductor Second Generation 0.18um 5V/40V BCD Process Platform Successfully Mass Produced
June 14, 2018 09:36 HKT/SGT
The Analog IP Portfolio Enables Hua Hong Semiconductor to Focus on the Development of MCU Market
May 8, 2018 16:26 HKT/SGT
Hua Hong Semiconductor Redoubled Shipment of Financial IC Card Chips to Over 400 Million in 2017
Dec 27, 2017 17:17 HKT/SGT
Hua Hong Semiconductor's 90nm G2 eFlash Process Platform Successfully Achieved Mass Production
Dec 15, 2017 14:40 HKT/SGT
Hua Hong Semiconductor introduces 12-bit SAR ADC IP to enable Ultra-Low Power MCU Platforms
More news >>
 News Alerts
Copyright © 2024 ACN Newswire - Asia Corporate News Network
Home | About us | Services | Partners | Events | Login | Contact us | Privacy Policy | Terms of Use | RSS
US: +1 214 890 4418 | Beijing: +86 400 879 3881 | Hong Kong: +852 8192 4922 | Singapore: +65 6549 7068 | Tokyo: +81 3 6859 8575

Connect With us: